Has anyone figured out a way of implementing a DELPHI compact thermal model (of an IC chip) in Solidworks Flow simulation?
There is an opened SPR-764006 for this functionality. I suggest you vote this SPR via your Customer portal.
I think you could do this with the anisotropic materials and some basic calculations using a multi material part where you tune the conductivities to match the prescribed resistances for the directions and over the inner and outer regions. It might not be perfect but it should be close.
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